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A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

G. Thieu, J. Schmechel, K. Weide-Zaage, K. Schmidt, D. Hagenah, и G. Payá-Vayá. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), стр. 1-5. (апреля 2023)
DOI: 10.1109/EuroSimE56861.2023.10100757

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Gia Anh Bao Phan

Vinh An Thieu-Simchen

Jin Bao

Wenwen Bao

Gia Toussaint

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TAPRE-HBM: Trace-Based Processor Rapid Emulation Using HBM on FPGAsJ. Knödtel, H. Muñoz Hernandez, A. Lehnert, G. Thieu, S. Gesper, G. Payá-Vayá, и M. Reichenbach. Applied Reconfigurable Computing. Architectures, Tools, and Applications, стр. 307--321. Cham, Springer Nature Switzerland, (2023)ZuSE KI-AVFG. Thieu, S. Gesper, G. Payá-Vayá, C. Riggers, O. Renke, T. Fiedler, J. Marten, T. Stuckenberg, H. Blume, C. Weis и 18 other автор(ы). (2023)A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation ExposureG. Thieu, J. Schmechel, K. Weide-Zaage, K. Schmidt, D. Hagenah, и G. Payá-Vayá. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), стр. 1-5. (апреля 2023)ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous DrivingG. Thieu, S. Gesper, G. Payá-Vayá, C. Riggers, O. Renke, T. Fiedler, J. Marten, T. Stuckenberg, H. Blume, C. Weis и 18 other автор(ы). 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), стр. 1-6. (апреля 2023)Radiation Tolerant Reconfigurable Hardware Architecture Design MethodologyE. Trumann, G. Thieu, J. Schmechel, K. Weide-Zaage, K. Schmidt, D. Hagenah, и G. Payá-Vayá. Applied Reconfigurable Computing. Architectures, Tools, and Applications, стр. 357--360. Cham, Springer Nature Switzerland, (2023)N2V2PRO: Neural Network Mapping Framework for a Custom Vector Processor ArchitectureS. Gesper, G. Thieu, D. Köhler, M. Kock, T. Berthold, O. Renke, H. Blume, и G. Payá-Vayá. 2023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), стр. 94-99. (сентября 2023)ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving.G. Thieu, S. Gesper, G. Vayá, C. Riggers, O. Renke, T. Fiedler, J. Marten, T. Stuckenberg, H. Blume, C. Weis и 18 other автор(ы). DATE, стр. 1-6. IEEE, (2023)N2V2PROS. Gesper, G. Thieu, D. Kohler, M. Kock, T. Berthold, O. Renke, H. Blume, и G. Paya-Vaya. (2023)Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology.E. Trumann, G. Thieu, J. Schmechel, K. Weide-Zaage, K. Schmidt, D. Hagenah, и G. Vayá. ARC, том 14251 из Lecture Notes in Computer Science, стр. 357-360. Springer, (2023)TAPRE-HBM: Trace-Based Processor Rapid Emulation Using HBM on FPGAs.J. Knödtel, H. Hernandez, A. Lehnert, G. Thieu, S. Gesper, G. Vayá, и M. Reichenbach. ARC, том 14251 из Lecture Notes in Computer Science, стр. 307-321. Springer, (2023)

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