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A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.

J. Hu, B. Jing, Y. Huang, X. Jiao, M. Sun, and L. Li. IEEE Access, (2020)

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Xiaoxuan Huang

Li Jiao

Yang Jiao

Xiangyang Jiao

Yuanyong Jiao

Other publications of authors with the same name

Adaptive Fine-Tuning in Degradation-Time-Series Forecasting via Generating Source Domain.J. Pan, B. Jing, S. Wang, X. Yuwen, and X. Jiao. IEEE Access, (2024)A Diagnosis Framework for High-reliability Equipment with Small Sample Based on Transfer Learning.J. Pan, B. Jing, X. Jiao, S. Wang, and Q. Zhang. Complex., (2022)Degradation Pattern Identification and Remaining Useful Life Prediction for Mechanical Equipment Using SKF-EN.S. Wang, B. Jing, X. Jiao, and J. Pan. IEEE Access, (2020)Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes.L. Li, B. Jing, J. Hu, X. Jiao, J. Pan, and H. Sun. IEEE Access, (2020)A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.J. Hu, B. Jing, Y. Huang, X. Jiao, M. Sun, and L. Li. IEEE Access, (2020)Analysis and Application of Grey Wolf Optimizer-Long Short-Term Memory.J. Pan, B. Jing, X. Jiao, and S. Wang. IEEE Access, (2020)Fault Knowledge Graph Construction and Platform Development for Aircraft PHM.X. Meng, B. Jing, S. Wang, J. Pan, Y. Huang, and X. Jiao. Sensors, 24 (1): 231 (2024)Research on Question Answering for Knowledge graph of Aircraft PHM Fault.X. Meng, B. Jing, L. Xia, J. Li, X. Jiao, S. Pei, and P. Jiang. CCIS, page 457-461. IEEE, (2023)Coupling Fault Diagnosis Based on Graph Neural Network.S. Wang, B. Jing, J. Pan, F. Xia, X. Zhang, and X. Jiao. SAFEPROCESS, page 1-5. IEEE, (2023)Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load.J. Dong, Y. Long, X. Jiao, and Y. Huang. IEEE Access, (2021)

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Disambiguation of "Jiao, Xiaoxuan"

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A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.

Please choose a person to relate this publication to

Xiaoxuan Huang

Li Jiao

Yang Jiao

Xiangyang Jiao

Yuanyong Jiao

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Jiao, Xiaoxuan"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.

Please choose a person to relate this publication to

Xiaoxuan Huang

Li Jiao

Yang Jiao

Xiangyang Jiao

Yuanyong Jiao

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.