( en | de | ru )

 

Disambiguation of "Sampson, Jack"

Author of the publication

copydeleteadd this publication to your clipboard
A hardware accelerated multilevel visual classifier for embedded visual-assist systems.

, , , , and . ICCAD, page 96-100. IEEE, (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Sampson Asorakos

Georgios Sampson

John Sampson

Georgios Sampson

Cortney Sampson

 

Other publications of authors with the same name

Context-Aware Collaborative Object Recognition For Distributed Multi Camera Time Series Data., , and . SoICT, page 154-161. ACM, (2019)A Saliency-Driven LCD Power Management System., , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 24 (8): 2689-2702 (2016)D-SOAP: Dynamic Spatial Orientation Affinity Prediction for Caching in Multi-Orientation Memory Systems., and . MICRO, page 581-595. IEEE, (2020)Evaluation of Tradeoffs in the Design of FPGA Fabrics Using Electrostrictive 2-D FETs., and . IEEE Trans. Very Large Scale Integr. Syst., 29 (4): 691-701 (2021)MaxTracker: Continuously Tracking the Maximum Computation Progress for Energy Harvesting ReRAM-based CNN Accelerators., , , , , , and . ACM Trans. Embed. Comput. Syst., 20 (5s): 78:1-78:23 (2021)EECache: A Comprehensive Study on the Architectural Design for Energy-Efficient Last-Level Caches in Chip Multiprocessors., , , , , , , and . ACM Trans. Archit. Code Optim., 12 (2): 17:1-17:22 (2015)GreenDroid: A mobile application processor for a future of dark silicon., , , , , , , and . Hot Chips Symposium, page 1-39. IEEE, (2010)An architecture interface and offload model for low-overhead, near-data, distributed accelerators., , and . MICRO, page 1160-1177. IEEE, (2022)Fluid: a framework for approximate concurrency via controlled dependency relaxation., , , , , , and . PLDI, page 252-267. ACM, (2021)An examination of the architecture and system-level tradeoffs of employing steep slope devices in 3D CMPs., , , and . ISCA, page 241-252. IEEE Computer Society, (2014)