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Simulation and analysis of DC and RF performances degradation of NMOS transistors under hot carrier injection mechanism., , , , и . IECON, стр. 7969-7973. IEEE, (2017)Determination of temperature change inside IC packages during laser ablation of molding compound., , , и . Microelectron. Reliab., 48 (8-9): 1263-1267 (2008)Comprehensive failure analysis of leakage faults in bipolar transistors., , , , и . Microelectron. Reliab., 42 (9-11): 1449-1452 (2002)Study and validation of a power-rail ESD clamp in BiCMOS process with a reduced temperature dependency of its leakage current., , , , , , , и . Microelectron. Reliab., 44 (9-11): 1799-1804 (2004)An Experience of Engineering of MAS for Smart Environments: Extension of ASPECS., , , и . IIMSS, стр. 649-658. Springer, (2016)Applied TRL Calibration Method to Differential Devices Embedded in a Test Board., , , и . RWS, стр. 1-4. IEEE, (2019)Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems., , , , , , и . Microelectron. Reliab., 44 (9-11): 1559-1563 (2004)La morale humaine et les sciences, , , , , , , , и . Sciences & Philosophie Éditions Matériologiques, (марта 2011)Isolating failing sites in IC packages using time domain reflectometry: Case studies., , , и . Microelectron. Reliab., 45 (9-11): 1639-1644 (2005)Performances of RF PA classes in LINC systems., , , , и . ISCAS, стр. 2179-2182. IEEE, (2012)