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A novel power reduction technique using wire multiplexing., , , и . SoCC, стр. 149-152. IEEE, (2017)A Survey on the Security of Wired, Wireless, and 3D Network-on-Chips., , , , , и . IEEE Access, (2021)A Serious Game for a Serious Situation: Encouraging Healthy Behaviors for Children with ASD During COVID-19 Pandemic., , и . JCSG, том 13476 из Lecture Notes in Computer Science, стр. 140-154. Springer, (2022)A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias., , , и . MES@ISCA, стр. 9-16. ACM, (2014)LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency., , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (4): 895-908 (2020)Understanding the Sources of Power Consumption in Mobile SoCs., , , и . IGSC, стр. 1-7. IEEE, (2018)A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias., , , , и . Microprocess. Microsystems, (2016)Work-in-Progress: A Flexible Router Architecture for 3D NoCs., , и . RTSS, стр. 375-377. IEEE Computer Society, (2017)Novel flexible buffering architectures for 3D-NoCs., , , , , и . Sustain. Comput. Informatics Syst., 29 (Part): 100472 (2021)Performance evaluation of buffer sharing routers for Network on Chip., , и . MWSCAS, стр. 1-4. IEEE, (2016)