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Cross-layer design and analysis of a low power, high density STT-MRAM for embedded systems.

, , , , , , , , , и . ISCAS, стр. 1-4. IEEE, (2017)

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Siddharth Kaza

Siddharth Nanguneri

Siddharth Hegde

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Siddharth Joshi

 

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Magnetic Domain Wall Memory: A DTCO study for Memory Applications., , , и . ESSDERC, стр. 41-44. IEEE, (2023)Characterization and Fault Modeling of Intermediate State Defects in STT-MRAM., , , , , и . DATE, стр. 1717-1722. IEEE, (2021)Cross-layer design and analysis of a low power, high density STT-MRAM for embedded systems., , , , , , , , , и . ISCAS, стр. 1-4. IEEE, (2017)Survey on STT-MRAM Testing: Failure Mechanisms, Fault Models, and Tests., , , , и . CoRR, (2020)Edge-induced reliability & performance degradation in STT-MRAM: an etch engineering solution., , , , , , , , , и 3 other автор(ы). IRPS, стр. 1-5. IEEE, (2021)Special Session: STT-MRAMs: Technology, Design and Test., , , , , и . VTS, стр. 1-10. IEEE, (2022)Testing STT-MRAM: Manufacturing Defects, Fault Models, and Test Solutions., , , , , и . ITC, стр. 143-152. IEEE, (2021)Device-Aware Test: A New Test Approach Towards DPPB Level., , , , , , , и . ITC, стр. 1-10. IEEE, (2019)Pinhole Defect Characterization and Fault Modeling for STT-MRAM Testing., , , , , , , , и . ETS, стр. 1-6. IEEE, (2019)MTJ degradation in SOT-MRAM by self-heating-induced diffusion., , , , , , , и . IRPS, стр. 4. IEEE, (2022)