( en | de | ru )

 

Disambiguation of "Yu, Wenjian"

Author of the publication

copydeleteadd this publication to your clipboard
Reliability aware through silicon via planning for 3D stacked ICs.

, , , , , , , and . DATE, page 288-291. IEEE, (2009)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Wenjian Ma

Wenjian Jia

Wenjian Sha

Yu-Ting Yu

Yu-Yu Su

 

Other publications of authors with the same name

Linear Dropout Regulator based power distribution design under worst loading., , , , and . ASICON, page 539-542. IEEE, (2011)Faster Tensor Train Decomposition for Sparse Data., , and . CoRR, (2019)Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning., , , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (4): 645-658 (2007)Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 25 (1): 12-18 (2006)Floating Random Walk-Based Capacitance Simulation Considering General Floating Metals., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (8): 1711-1715 (2018)A Fast Implementation of Singular Value Thresholding Algorithm using Recycling Rank Revealing Randomized Singular Value Decomposition., and . CoRR, (2017)A Rank Revealing Randomized Singular Value Decomposition (R3SVD) Algorithm for Low-rank Matrix Approximations., , and . CoRR, (2016)Fast and Accurate Tensor Completion with Tensor Trains: A System Identification Approach., , , and . CoRR, (2018)Predicting the worst-case voltage violation in a 3D power network., , , , , and . SLIP, page 93-98. ACM, (2009)pGRASS-Solver: A Graph Spectral Sparsification-Based Parallel Iterative Solver for Large-Scale Power Grid Analysis., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (9): 3031-3044 (September 2023)