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Impact of local interconnects on ESD design., , , , и . ICICDT, стр. 1-4. IEEE, (2015)ESD On-Wafer Characterization: Is TLP Still the Right Measurement Tool?, , , , , , , и . IEEE Trans. Instrumentation and Measurement, 58 (10): 3418-3426 (2009)Quasi-3D method: Time-efficient TCAD and mixed-mode simulations on finFET technologies., , , , и . CICC, стр. 1-4. IEEE, (2013)Inductor-based ESD protection under CDM-like ESD stress conditions for RF applications., , , , , , , и . CICC, стр. 49-52. IEEE, (2008)A plug-and-play wideband RF circuit ESD protection methodology: T-diodes., , , , , , , , , и . Microelectron. Reliab., 49 (12): 1440-1446 (2009)Impact of on- and off-chip protection on the transient-induced latch-up sensitivity of CMOS IC., , , и . Microelectron. Reliab., (2016)Concise Analytical Expression for Wunsch-Bell 1-D Pulsed Heating and Applications in ESD Using TLP., , , , , , , , , и 2 other автор(ы). IRPS, стр. 1-6. IEEE, (2019)ESD characterisation of a-IGZO TFTs on Si and foil substrates., , , , , , , , и . ESSDERC, стр. 276-279. IEEE, (2017)Active-lite interposer for 2.5 & 3D integration., , , , , , , , , и 5 other автор(ы). VLSIC, стр. 222-. IEEE, (2015)ESD protection diodes in optical interposer technology., , , , , , и . ICICDT, стр. 1-4. IEEE, (2015)