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Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package.

C. Yang, W. Liu, and C. Liu. Microelectron. Reliab., 52 (5): 855-860 (2012)

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Gilbert C Liu

C W Strüder

Christian C W Grovermann

Stefan C W Krauter

Other publications of authors with the same name

3D Stackable Vertical Ferroelectric Tunneling Junction (V-FTJ) with on/off Ratio 1500x, Applicable Cell Current, Self-Rectifying Ratio 1000x, Robust Endurance of 10⁹ Cycles, Multilevel and Demonstrated Macro Operation Toward High-Density BEOL NVMs.J. Lee, F. Chang, K. Hsiang, P. Chen, Z. Luo, Z. Li, J. Tsai, C. Liu, and M. Lee. VLSI Technology and Circuits, page 1-2. IEEE, (2023)AC-1: a clock-powered microprocessor.W. Athas, N. Tzartzanis, L. Svensson, L. Peterson, H. Li, X. Jiang, P. Wang, and W. Liu. ISLPED, page 328-333. ACM, (1997)Objective evidence of cognitive complaints in Chronic Fatigue Syndrome: A BOLD fMRI study of verbal working memory.G. Lange, J. Steffener, D. Cook, B. Bly, C. Christodoulou, W. Liu, J. DeLuca, and B. Natelson. NeuroImage, 26 (2): 513-524 (2005)An Experience of Using FDOOA Method to Develop a Telecommunications Network Management System.Y. Hung, W. Liu, and C. Chung. TOOLS (24), page 320-329. IEEE Computer Society, (1997)Mobility Enhancement and Reliability Characterization of Back-Channel-Etch Amorphous InGaZnO TFT with Double Layers.C. Yen, A. Tai, Y. Liu, C. Yeh, and C. Liu. DRC, page 1-2. IEEE, (2020)Energy-recovery CMOS for highly pipelined DSP designs.W. Athas, W. Liu, and L. Svensson. ISLPED, page 101-104. IEEE, (1996)First Demonstration of a-IGZO GAA Nanosheet FETs Featuring Achievable SS=61mV/dec, Ioff<10-7 μA/μm, DIBL =44mV/V, Positive VT, and Process Temp. of 300 °C.J. Chiu, E. Sarkar, Y. Liu, Y. Chen, Y. Fan, and C. Liu. VLSI Technology and Circuits, page 1-2. IEEE, (2023)FeRAM Recovery up to 200 Periods with Accumulated Endurance 1012 Cycles and an Applicable Array Circuit toward Unlimited eNVM Operations.K. Hsiang, J. Lee, F. Chang, Z. Lou, Z. Li, Z. Li, J. Chen, C. Liu, T. Hou, and M. Lee. VLSI Technology and Circuits, page 1-2. IEEE, (2023)Non-perturbative time-dependent numerical simulation for electromagnetically induced transparency and slow light in three-level Lambda-type atoms.M. Wu, and W. Liu. Comput. Phys. Commun., 182 (1): 143-145 (2011)A web services-based multidisciplinary design optimization framework for complex engineering systems with uncertainties.C. Liu, X. Jin, and L. Li. Comput. Ind., 65 (4): 585-597 (2014)

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Disambiguation of "Liu, W. C."

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Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package.

Please choose a person to relate this publication to

Gilbert C Liu

C W Strüder

Christian C W Grovermann

Stefan C W Krauter

Stefan C W Krauter

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liu, W. C."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package.

Please choose a person to relate this publication to

Gilbert C Liu

C W Strüder

Christian C W Grovermann

Stefan C W Krauter

Stefan C W Krauter

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package.