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Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

Y. Liu, Z. Zhu, R. Ding, X. Liu, Q. Lu, X. Yin, and Y. Yang. APCCAS, page 439-442. IEEE, (2018)

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Liu Liu

Keetsin Liu

Ching Liu

Other publications of authors with the same name

Capacitance characterization of tapered through-silicon-via considering MOS effect.F. Wang, Z. Zhu, Y. Yang, X. Liu, and R. Ding. Microelectron. J., 45 (2): 205-210 (2014)Voltage Reference With Linear-Temperature-Dependent Power Consumption.H. Zhuang, X. Liu, and H. Wang. IEEE Trans. Very Large Scale Integr. Syst., 28 (4): 1043-1049 (2020)A multiscale region-based approach to automatic SAR image registration using CLPSO.G. Wang, X. Liu, L. Jiao, and S. Wang. IGARSS, page 5226-5229. IEEE, (2014)Voltage Comparator With 60% Faster Speed by Using Charge Pump.H. Zhuang, H. Tang, and X. Liu. IEEE Trans. Circuits Syst., 67-II (12): 2923-2927 (2020)Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.Y. Yang, X. Liu, Z. Zhu, and R. Ding. IEICE Electron. Express, 11 (14): 20140504 (2014)Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.X. Liu, Y. Liu, T. Zhang, Q. Lu, and Z. Zhu. IEEE Trans. Circuits Syst. II Express Briefs, 70 (2): 526-530 (February 2023)Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).Y. Liu, Z. Zhu, X. Liu, H. Gu, and L. Guo. IEICE Electron. Express, 15 (24): 20180878 (2018)Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.Y. Liu, Z. Zhu, R. Ding, X. Liu, Q. Lu, X. Yin, and Y. Yang. APCCAS, page 439-442. IEEE, (2018)Electromagnetic modeling and analysis of the tapered differential through glass vias.Y. Liu, Z. Zhu, X. Liu, Q. Lu, X. Yin, L. Guo, and Y. Yang. Microelectron. J., (2019)A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields.L. Wang, X. Liu, Y. En, and Z. Zhu. IEEE Trans. Circuits Syst. II Express Briefs, 70 (2): 521-525 (February 2023)

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Disambiguation of "Liu, Xiaoxian"

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Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Keetsin Liu

Ching Liu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liu, Xiaoxian"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Keetsin Liu

Ching Liu

Other publications of authors with the same name

Disambiguation

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URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.