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Multi-factory capacity planning in semiconductor assembly and test manufacturing with multiple-chip products., , , , and . CASE, page 247-252. IEEE, (2006)Steady-State Throughput and Scheduling Analysis of Multicluster Tools: A Decomposition Approach., , , and . IEEE Trans Autom. Sci. Eng., 5 (2): 321-336 (2008)Fixture-based industrial robot calibration for silicon wafer handling., and . Ind. Robot, 32 (1): 43-48 (2005)E-manufacturing in the semiconductor industry., and . IEEE Robotics Autom. Mag., 13 (4): 25-32 (2006)Designing robot grippers: optimal edge contacts for part alignment., and . Robotica, 25 (3): 341-349 (2007)Editorial e-Manufacturing in the Semiconductor Industry., , , , and . IEEE Trans Autom. Sci. Eng., 4 (4): 485-487 (2007)The Toppling Graph: Designing Pin Sequences for Part Feeding., , , , and . ICRA, page 139-146. IEEE, (2000)Production planning with joint resources usage semiconductor test manufacturing., , , and . CASE, page 49-54. IEEE, (2005)Hierarchical Capacity Planning With Reconfigurable Kits in Global Semiconductor Assembly and Test Manufacturing., , , , , and . IEEE Trans Autom. Sci. Eng., 4 (4): 543-552 (2007)Gripper point contacts for part alignment., and . IEEE Trans. Robotics Autom., 18 (6): 902-910 (2002)