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320 × 240 Back-Illuminated 10-µm CAPD Pixels for High-Speed Modulation Time-of-Flight CMOS Image Sensor.

, , , , , , , , , , , , and . IEEE J. Solid State Circuits, 53 (4): 1071-1078 (2018)

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Precise visual inspection for LSI wafer patterns using subpixel image alignment., , , , and . WACV, page 26-34. IEEE, (1994)Analyzing Causal Relationships of Sensor Data and Infrared Images to Stabilize Garbage Power Generation., , and . ICMLC, page 1-6. IEEE, (2019)Precise detection of short-circuit defects on TFT substrate by infrared image matching., , , and . Syst. Comput. Jpn., 30 (12): 72-84 (1999)Automated visual inspection for lsi water multilayer patterns by cascade pattern matching algorithm., , , , , and . Syst. Comput. Jpn., 21 (12): 65-77 (1990)A Basic Study on Railway Facility Extraction Using a Single-Shot Multi-Box Detector., , and . ICMLC, page 1-7. IEEE, (2019)Unified evaluation method of white uniformity for electronic displays., , and . IECON, page 8341-8345. IEEE, (2013)Threshold setting assisted by numerical analysis methods in automatic visual inspection using gray-scale image comparison., , , and . Syst. Comput. Jpn., 29 (14): 81-91 (1998)Optimum threshold generation for automated visual inspection of large-scale integration wafer patterns., , and . Syst. Comput. Jpn., 27 (11): 74-86 (1996)Utilization of the Infrared Image Capturing Combustion State for Estimating the Steam Flow Aming to Stabilize Garbage Power Generation., , and . ICMLC, page 1-5. IEEE, (2019)320 × 240 Back-Illuminated 10-µm CAPD Pixels for High-Speed Modulation Time-of-Flight CMOS Image Sensor., , , , , , , , , and 3 other author(s). IEEE J. Solid State Circuits, 53 (4): 1071-1078 (2018)