Inproceedings,
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
S. Ghosh, Q. Smets, S. Banerjee, T. Schram, K. Kennes, R. Verheyen, P. Kumar, M. Boulon, B. Groven, H. Silva, S. Kundu, D. Cott, D. Lin, P. Favia, T. Nuytten, A. Phommahaxay, I. Asselberghs, C. Rosa, G. Kar, and S. Brems.VLSI Technology and Circuits, page 1-2. IEEE, (2023)
Meta data
- BibTeX key
- conf/vlsit/GhoshSBSKVKBGSK23
- entry type
- inproceedings
- booktitle
- VLSI Technology and Circuits
- year
- 2023
- pages
- 1-2
- publisher
- IEEE
- crossref
- conf/vlsit/2023
- ee
- https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185215
- isbn
- 978-4-86348-806-9
- url
- http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#GhoshSBSKVKBGSK23
Tags
Users
Comments and Reviewsshow / hide
Cite this publication
More citation styles
- please select -%0 Conference Paper
%1 conf/vlsit/GhoshSBSKVKBGSK23
%A Ghosh, Souvik
%A Smets, Quentin
%A Banerjee, S.
%A Schram, Tom
%A Kennes, K.
%A Verheyen, R.
%A Kumar, P.
%A Boulon, M.-E.
%A Groven, Benjamin
%A Silva, H. M.
%A Kundu, Shreya
%A Cott, Daire
%A Lin, Dennis
%A Favia, P.
%A Nuytten, T.
%A Phommahaxay, A.
%A Asselberghs, Inge
%A Rosa, C. De La
%A Kar, Gouri Sankar
%A Brems, Steven
%B VLSI Technology and Circuits
%D 2023
%I IEEE
%K dblp
%P 1-2
%T Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
%U http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#GhoshSBSKVKBGSK23
%@ 978-4-86348-806-9
@inproceedings{conf/vlsit/GhoshSBSKVKBGSK23,
added-at = {2024-05-29T00:00:00.000+0200},
author = {Ghosh, Souvik and Smets, Quentin and Banerjee, S. and Schram, Tom and Kennes, K. and Verheyen, R. and Kumar, P. and Boulon, M.-E. and Groven, Benjamin and Silva, H. M. and Kundu, Shreya and Cott, Daire and Lin, Dennis and Favia, P. and Nuytten, T. and Phommahaxay, A. and Asselberghs, Inge and Rosa, C. De La and Kar, Gouri Sankar and Brems, Steven},
biburl = {https://www.bibsonomy.org/bibtex/241cccd6dc493f795f998d9f64cef0a8d/dblp},
booktitle = {VLSI Technology and Circuits},
crossref = {conf/vlsit/2023},
ee = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185215},
interhash = {0963f6606dabfa522051278d7b6a0045},
intrahash = {41cccd6dc493f795f998d9f64cef0a8d},
isbn = {978-4-86348-806-9},
keywords = {dblp},
pages = {1-2},
publisher = {IEEE},
timestamp = {2024-06-03T07:22:13.000+0200},
title = {Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.},
url = {http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#GhoshSBSKVKBGSK23},
year = 2023
}