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Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.

S. Ghosh, Q. Smets, S. Banerjee, T. Schram, K. Kennes, R. Verheyen, P. Kumar, M. Boulon, B. Groven, H. Silva, S. Kundu, D. Cott, D. Lin, P. Favia, T. Nuytten, A. Phommahaxay, I. Asselberghs, C. Rosa, G. Kar, and S. Brems. VLSI Technology and Circuits, page 1-2. IEEE, (2023)

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Lin Lin

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WS2 transistors on 300 mm wafers with BEOL compatibility.T. Schram, Q. Smets, B. Groven, M. Heyne, E. Kunnen, A. Thiam, K. Devriendt, A. Delabie, D. Lin, M. Lux and 8 other author(s). ESSDERC, page 212-215. IEEE, (2017)Modularized low temperature LNO/PZT/LNO ferroelectric capacitor-over-interconnect (COI) FeRAM for advanced SOC (ASOC) application.S. Lung, D. Lin, S. Chen, G. Weng, C. Liu, S. Lai, C. Tsai, T. Wu, and R. Liu. CICC, page 479-482. IEEE, (2002)3DApe: A Real-Time 3D Audio Playback Engine.C. Jin, A. Kan, D. Lin, M. McGinity, K. Smith, T. Tan, and A. van Schaik. (May 2005)Real-time, head-tracked 3D audio with unlimited simultaneous soundsC. Jin, T. Tan, A. Kan, D. Lin, A. Schaik, K. Smith, and M. McGinity. (2005)Tunnel FETs using Phosphorene/ReS2 heterostructures.Y. Balaji, Q. Smets, D. Lin, I. Asselberghs, I. Radu, and G. Groeseneken. DRC, page 113-114. IEEE, (2019)Beyond-Si materials and devices for more Moore and more than Moore applications.N. Collaert, A. Alian, H. Arimura, G. Boccardi, G. Eneman, J. Franco, T. Ivanov, D. Lin, J. Mitard, S. Ramesh and 16 other author(s). ICICDT, page 1-5. IEEE, (2016)On MX2-based metal-oxide-semiconductor device capacitance-voltage characteristics and dual-gate operation.D. Lin, X. Wu, V. Mootheri, D. Cott, B. Groven, P. Morin, I. Asselberghs, and I. Radu. DRC, page 1-2. IEEE, (2021)Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.S. Ghosh, Q. Smets, S. Banerjee, T. Schram, K. Kennes, R. Verheyen, P. Kumar, M. Boulon, B. Groven, H. Silva and 10 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)Impact of gate stack processing on the hysteresis of 300 mm integrated WS2 FETs.L. Panarella, B. Kaczer, Q. Smets, D. Verreck, T. Schram, D. Cott, D. Lin, S. Tyaginov, I. Asselberghs, C. de la Rosa and 2 other author(s). IRPS, page 1-6. IEEE, (2023)A NONPARAMETRIC DISPERSION TEST FOR UNREPLICATED TWO-LEVEL FRACTIONAL FACTORIAL DESIGNSR. McGrath, and D. Lin. Journal of Nonparametric Statistics, 14 (6): 699--714 (2002)

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Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.

Please choose a person to relate this publication to

Lin Lin

Lin Lin

Lin Lin

Lin Lin

Lin Lin

Other publications of authors with the same name

Disambiguation

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Disambiguation of "Lin, Dennis"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.

Please choose a person to relate this publication to

Lin Lin

Lin Lin

Lin Lin

Lin Lin

Lin Lin

Other publications of authors with the same name

Disambiguation

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Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.