Inproceedings,
Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling.
Z. Wang, J. Sun, A. Goksoy, S. Mandal, J. Seo, C. Chakrabarti, Ü. Ogras, V. Chhabria, and Y. Cao.ASICON, page 1-4. IEEE, (2023)
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- conf/asicon/WangSGMSCOCC23
- entry type
- inproceedings
- booktitle
- ASICON
- year
- 2023
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/asicon/2023
- ee
- https://doi.org/10.1109/ASICON58565.2023.10396377
- isbn
- 979-8-3503-1298-0
- url
- http://dblp.uni-trier.de/db/conf/asicon/asicon2023.html#WangSGMSCOCC23
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%1 conf/asicon/WangSGMSCOCC23
%A Wang, Zhenyu
%A Sun, Jingbo
%A Goksoy, A. Alper
%A Mandal, Sumit K.
%A Seo, Jae-Sun
%A Chakrabarti, Chaitali
%A Ogras, Ümit Y.
%A Chhabria, Vidya A.
%A Cao, Yu
%B ASICON
%D 2023
%I IEEE
%K dblp
%P 1-4
%T Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling.
%U http://dblp.uni-trier.de/db/conf/asicon/asicon2023.html#WangSGMSCOCC23
%@ 979-8-3503-1298-0
@inproceedings{conf/asicon/WangSGMSCOCC23,
added-at = {2024-02-16T00:00:00.000+0100},
author = {Wang, Zhenyu and Sun, Jingbo and Goksoy, A. Alper and Mandal, Sumit K. and Seo, Jae-Sun and Chakrabarti, Chaitali and Ogras, Ümit Y. and Chhabria, Vidya A. and Cao, Yu},
biburl = {https://www.bibsonomy.org/bibtex/221dcab7f3e11accc7a880cf075c20a20/dblp},
booktitle = {ASICON},
crossref = {conf/asicon/2023},
ee = {https://doi.org/10.1109/ASICON58565.2023.10396377},
interhash = {213499935d606b246b18dcbdc8d65911},
intrahash = {21dcab7f3e11accc7a880cf075c20a20},
isbn = {979-8-3503-1298-0},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-09T23:07:08.000+0200},
title = {Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling.},
url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2023.html#WangSGMSCOCC23},
year = 2023
}