%0 Conference Paper %1 conf/isqed/AlamWGTT05 %A Alam, Syed M. %A Wei, Frank L. %A Gan, Chee Lip %A Thompson, Carl V. %A Troxel, Donald E. %B ISQED %D 2005 %I IEEE Computer Society %K dblp %P 303-308 %T Electromigration Reliability Comparison of Cu and Al Interconnects. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#AlamWGTT05 %@ 0-7695-2301-3

@inproceedings{conf/isqed/AlamWGTT05, added-at = {2023-03-23T00:00:00.000+0100}, author = {Alam, Syed M. and Wei, Frank L. and Gan, Chee Lip and Thompson, Carl V. and Troxel, Donald E.}, biburl = {https://www.bibsonomy.org/bibtex/2660c2a73fe722df8ab069ba56debd587/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2005}, ee = {https://doi.ieeecomputersociety.org/10.1109/ISQED.2005.51}, interhash = {3c2dffbb348c6faa01fda9f6e66586e8}, intrahash = {660c2a73fe722df8ab069ba56debd587}, isbn = {0-7695-2301-3}, keywords = {dblp}, pages = {303-308}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T14:10:17.000+0200}, title = {Electromigration Reliability Comparison of Cu and Al Interconnects.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#AlamWGTT05}, year = 2005 }