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%0 Conference Paper
%1 conf/isqed/AlamWGTT05
%A Alam, Syed M.
%A Wei, Frank L.
%A Gan, Chee Lip
%A Thompson, Carl V.
%A Troxel, Donald E.
%B ISQED
%D 2005
%I IEEE Computer Society
%K dblp
%P 303-308
%T Electromigration Reliability Comparison of Cu and Al Interconnects.
%U http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#AlamWGTT05
%@ 0-7695-2301-3
@inproceedings{conf/isqed/AlamWGTT05,
added-at = {2023-03-23T00:00:00.000+0100},
author = {Alam, Syed M. and Wei, Frank L. and Gan, Chee Lip and Thompson, Carl V. and Troxel, Donald E.},
biburl = {https://www.bibsonomy.org/bibtex/2660c2a73fe722df8ab069ba56debd587/dblp},
booktitle = {ISQED},
crossref = {conf/isqed/2005},
ee = {https://doi.ieeecomputersociety.org/10.1109/ISQED.2005.51},
interhash = {3c2dffbb348c6faa01fda9f6e66586e8},
intrahash = {660c2a73fe722df8ab069ba56debd587},
isbn = {0-7695-2301-3},
keywords = {dblp},
pages = {303-308},
publisher = {IEEE Computer Society},
timestamp = {2024-04-10T14:10:17.000+0200},
title = {Electromigration Reliability Comparison of Cu and Al Interconnects.},
url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#AlamWGTT05},
year = 2005
}