Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/irps/VandemaeleKBFCMMHG23
%A Vandemaele, Michiel
%A Kaczer, Ben
%A Bury, Erik
%A Franco, Jacopo
%A Chasin, Adrian
%A Makarov, Alexander
%A Mertens, Hans
%A Hellings, Geert
%A Groeseneken, Guido
%B IRPS
%D 2023
%I IEEE
%K dblp
%P 1-10
%T Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations: Invited Paper.
%U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#VandemaeleKBFCMMHG23
%@ 978-1-6654-5672-2
@inproceedings{conf/irps/VandemaeleKBFCMMHG23,
added-at = {2023-09-30T00:00:00.000+0200},
author = {Vandemaele, Michiel and Kaczer, Ben and Bury, Erik and Franco, Jacopo and Chasin, Adrian and Makarov, Alexander and Mertens, Hans and Hellings, Geert and Groeseneken, Guido},
biburl = {https://www.bibsonomy.org/bibtex/209a1d5430ec46ada1fe17bbad834497a/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2023},
ee = {https://doi.org/10.1109/IRPS48203.2023.10118211},
interhash = {91ebfade1512e108179fadb062db97ad},
intrahash = {09a1d5430ec46ada1fe17bbad834497a},
isbn = {978-1-6654-5672-2},
keywords = {dblp},
pages = {1-10},
publisher = {IEEE},
timestamp = {2024-04-09T12:18:52.000+0200},
title = {Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations: Invited Paper.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#VandemaeleKBFCMMHG23},
year = 2023
}