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%0 Conference Paper
%1 conf/irps/LinLLLTCCSC23
%A Lin, Y. H.
%A Lee, C. C.
%A Liao, C. Y.
%A Lin, M. H.
%A Tu, W. C.
%A Chen, Robin
%A Chen, H. P.
%A Shue, Winston S.
%A Cao, Min
%B IRPS
%D 2023
%I IEEE
%K dblp
%P 1-4
%T A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.
%U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LinLLLTCCSC23
%@ 978-1-6654-5672-2
@inproceedings{conf/irps/LinLLLTCCSC23,
added-at = {2023-05-24T00:00:00.000+0200},
author = {Lin, Y. H. and Lee, C. C. and Liao, C. Y. and Lin, M. H. and Tu, W. C. and Chen, Robin and Chen, H. P. and Shue, Winston S. and Cao, Min},
biburl = {https://www.bibsonomy.org/bibtex/27ee3b9cebaf76f2663ffec5fa63b1e52/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2023},
ee = {https://doi.org/10.1109/IRPS48203.2023.10117795},
interhash = {9a75252d7d42f72ff4d7d4076f01f6bc},
intrahash = {7ee3b9cebaf76f2663ffec5fa63b1e52},
isbn = {978-1-6654-5672-2},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-09T12:18:52.000+0200},
title = {A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LinLLLTCCSC23},
year = 2023
}