%0 Conference Paper %1 conf/3dic/LeeBFOTK11 %A Lee, Kang Wook %A Bea, Jichoel %A Fukushima, Takafumi %A Ohara, Yuki %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LeeBFOTK11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/LeeBFOTK11, added-at = {2021-02-16T00:00:00.000+0100}, author = {Lee, Kang Wook and Bea, Jichoel and Fukushima, Takafumi and Ohara, Yuki and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/274981cfdd04e1d7ab76eb0816b27cebf/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262975}, interhash = {b0875c7a9c5fb515b48cd4c30103b053}, intrahash = {74981cfdd04e1d7ab76eb0816b27cebf}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:22.000+0200}, title = {High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LeeBFOTK11}, year = 2011 }