Inproceedings,
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.
M. Murugesan, Y. Ohara, J. Bea, K. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi.3DIC, page 1-5. IEEE, (2010)
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- conf/3dic/MurugesanOBLFTK10
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- 3DIC
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- 2010
- pages
- 1-5
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- IEEE
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- conf/3dic/2010
- ee
- https://doi.org/10.1109/3DIC.2010.5751432
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- 978-1-4577-0526-7
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#MurugesanOBLFTK10
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- please select -%0 Conference Paper
%1 conf/3dic/MurugesanOBLFTK10
%A Murugesan, Mariappan
%A Ohara, Yuki
%A Bea, Jichoel
%A Lee, Kang Wook
%A Fukushima, Takafumi
%A Tanaka, Tetsu
%A Koyanagi, Mitsumasa
%B 3DIC
%D 2010
%I IEEE
%K dblp
%P 1-5
%T Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#MurugesanOBLFTK10
%@ 978-1-4577-0526-7
@inproceedings{conf/3dic/MurugesanOBLFTK10,
added-at = {2021-02-16T00:00:00.000+0100},
author = {Murugesan, Mariappan and Ohara, Yuki and Bea, Jichoel and Lee, Kang Wook and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/23db44e34acc27b277b0ea6b3b3f19549/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2010},
ee = {https://doi.org/10.1109/3DIC.2010.5751432},
interhash = {c1d5a67ff7b7fb14f1a456051dfe5435},
intrahash = {3db44e34acc27b277b0ea6b3b3f19549},
isbn = {978-1-4577-0526-7},
keywords = {dblp},
pages = {1-5},
publisher = {IEEE},
timestamp = {2024-04-10T12:11:20.000+0200},
title = {Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#MurugesanOBLFTK10},
year = 2010
}