%0 Conference Paper %1 conf/irps/MitaniHN18 %A Mitani, Yuichiro %A Higashi, Yusuke %A Nakasaki, Yasushi %B IRPS %D 2018 %I IEEE %K dblp %P 3 %T Study on mechanism of thermal curing in ultra-thin gate dielectrics. %U http://dblp.uni-trier.de/db/conf/irps/irps2018.html#MitaniHN18 %@ 978-1-5386-5479-8

@inproceedings{conf/irps/MitaniHN18, added-at = {2021-10-14T00:00:00.000+0200}, author = {Mitani, Yuichiro and Higashi, Yusuke and Nakasaki, Yasushi}, biburl = {https://www.bibsonomy.org/bibtex/27622325ac6966ae6638a7b3a4e93a203/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2018}, ee = {https://doi.org/10.1109/IRPS.2018.8353554}, interhash = {c8aae30085dffe30cce24853a1338a32}, intrahash = {7622325ac6966ae6638a7b3a4e93a203}, isbn = {978-1-5386-5479-8}, keywords = {dblp}, pages = 3, publisher = {IEEE}, timestamp = {2024-04-10T16:54:56.000+0200}, title = {Study on mechanism of thermal curing in ultra-thin gate dielectrics.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#MitaniHN18}, year = 2018 }