%0 Conference Paper %1 conf/irps/LesniewskaRTVVV20 %A Lesniewska, Alicja %A Roussel, Philippe J. %A Tierno, Davide %A Vega-Gonzalez, Victor %A van der Veen, Marleen H. %A Verdonck, Patrick %A Jourdan, Nicolas %A Wilson, Christopher J. %A Tökei, Zsolt %A Croes, Kris %B IRPS %D 2020 %I IEEE %K dblp %P 1-6 %T Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. %U http://dblp.uni-trier.de/db/conf/irps/irps2020.html#LesniewskaRTVVV20 %@ 978-1-7281-3199-3

@inproceedings{conf/irps/LesniewskaRTVVV20, added-at = {2022-12-02T00:00:00.000+0100}, author = {Lesniewska, Alicja and Roussel, Philippe J. and Tierno, Davide and Vega-Gonzalez, Victor and van der Veen, Marleen H. and Verdonck, Patrick and Jourdan, Nicolas and Wilson, Christopher J. and Tökei, Zsolt and Croes, Kris}, biburl = {https://www.bibsonomy.org/bibtex/23701995b7945fe37e0d751ee6d3f7b8b/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2020}, ee = {https://doi.org/10.1109/IRPS45951.2020.9129246}, interhash = {fe9cf32ed3f5d180fc1e952ff74f88a9}, intrahash = {3701995b7945fe37e0d751ee6d3f7b8b}, isbn = {978-1-7281-3199-3}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2024-04-10T16:56:46.000+0200}, title = {Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2020.html#LesniewskaRTVVV20}, year = 2020 }