%0 Conference Paper %1 conf/3dic/DaiNAGT15 %A Dai, Yuan Yuan %A Ng, Mei Zhen %A Anantha, P. %A Gan, Chee Lip %A Tan, Chuan Seng %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.9.1-TS8.9.5 %T Copper micro and nano particles mixture for 3D interconnections application. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#DaiNAGT15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/DaiNAGT15, added-at = {2021-10-14T00:00:00.000+0200}, author = {Dai, Yuan Yuan and Ng, Mei Zhen and Anantha, P. and Gan, Chee Lip and Tan, Chuan Seng}, biburl = {https://www.bibsonomy.org/bibtex/2d3fb154aeb85523a6d9d329c77f6b34f/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334614}, interhash = {fff3f22f822b9660eba6cb8114faac45}, intrahash = {d3fb154aeb85523a6d9d329c77f6b34f}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.9.1-TS8.9.5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Copper micro and nano particles mixture for 3D interconnections application.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#DaiNAGT15}, year = 2015 }