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Copper micro and nano particles mixture for 3D interconnections application.

Y. Dai, M. Ng, P. Anantha, C. Gan, and C. Tan. 3DIC, page TS8.9.1-TS8.9.5. IEEE, (2015)

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Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.A. Lim, A. Chang, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., 54 (11): 2555-2563 (2014)Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.C. Chua, H. Ong, K. Sanchez, P. Perdu, and C. Gan. Microelectron. Reliab., (2016)Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.V. Murugan, Z. Jia, G. Syaranamual, C. Gan, Y. Huang, and Z. Chen. Microelectron. Reliab., (2016)Circuit Level Reliability Analysis of Cu Interconnects.S. Alam, C. Gan, C. Thompson, and D. Troxel. ISQED, page 238-243. IEEE Computer Society, (2004)Explainable automated data estimation in Logic State Imaging of embedded SRAM.S. Chef, C. Chua, J. Tay, and C. Gan. ISCAS, page 1-5. IEEE, (2024)Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization.F. Infante, P. Perdu, H. Kor, C. Gan, and D. Lewis. Microelectron. Reliab., 51 (9-11): 1684-1688 (2011)Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.A. Lim, W. Neo, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., (2016)Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.W. Sasangka, G. Syaranamual, Y. Gao, R. Made, C. Gan, and C. Thompson. Microelectron. Reliab., (2017)Electromigration Reliability Comparison of Cu and Al Interconnects.S. Alam, F. Wei, C. Gan, C. Thompson, and D. Troxel. ISQED, page 303-308. IEEE Computer Society, (2005)Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing.W. Sasangka, G. Syaranamual, C. Gan, and C. Thompson. IRPS, page 6. IEEE, (2015)

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Disambiguation of "Gan, Chee Lip"

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Copper micro and nano particles mixture for 3D interconnections application.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Gan, Chee Lip"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Copper micro and nano particles mixture for 3D interconnections application.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Copper micro and nano particles mixture for 3D interconnections application.