%0 Conference Proceedings %1 citeulike:5942469 %A Lee, Abraham P. %A of Mechanical Engineers, American Society %A Congress, International Mechanical Engineering %A Exposition, %B Micro-electro-mechanical systems (MEMS), 2000 : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition %D 2000 %E Lee, Abraham P. %E Simon, J. %E Foster, F. K. %E Keynton, R. S. %I American Society of Mechanical Engineers %K mems 78a55-optics-electromagnetic-theory-technical-applications %T Micro-electro-mechanical systems (MEMS), 2000 : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2000, Orlando, Florida %U http://www.worldcat.org/isbn/0791819000 %X Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. Collection of 83 full-length, peer-reviewed technical papers from annual symposia. Major areas of discussion include: Microelectromechanical Systems:Design Methodology, Modeling and Characterization of MEMS; Novel Micromachining Processes and Packaging of MEMS; MEMS Applications; Microsensors and Microactuators; Micro-thermomechanical Devices and Microscale Heat Transfer; MEMS Device Design and Fabrication; Mechanics and Dynamics of MEMS. Microfluids: Behavior of Fluids in Microdevices, Observations and Measurements; Microfluidic Mixing and Separation Techniques; Component for Microfluidic Systems; Numerical Approaches to Microfluidic Device Development. MEMS Packaging and Packaging Review: Medical Applications of Microfluidic Systems & Sensors: Issues in the Manufacturing of MEMS and Related Micromechanical Systems %@ 0791819000

@proceedings{citeulike:5942469, abstract = {{Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. Collection of 83 full-length, peer-reviewed technical papers from annual symposia. Major areas of discussion include: Microelectromechanical Systems:Design Methodology, Modeling and Characterization of MEMS; Novel Micromachining Processes and Packaging of MEMS; MEMS Applications; Microsensors and Microactuators; Micro-thermomechanical Devices and Microscale Heat Transfer; MEMS Device Design and Fabrication; Mechanics and Dynamics of MEMS. Microfluids: Behavior of Fluids in Microdevices, Observations and Measurements; Microfluidic Mixing and Separation Techniques; Component for Microfluidic Systems; Numerical Approaches to Microfluidic Device Development. MEMS Packaging and Packaging Review: Medical Applications of Microfluidic Systems \& Sensors: Issues in the Manufacturing of MEMS and Related Micromechanical Systems}}, added-at = {2017-06-29T07:13:07.000+0200}, author = {Lee, Abraham P. and of Mechanical Engineers, American Society and Congress, International Mechanical Engineering and Exposition}, biburl = {https://www.bibsonomy.org/bibtex/200bb26a267267b3c0a181ef703951e60/gdmcbain}, booktitle = {Micro-electro-mechanical systems (MEMS), 2000 : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition}, citeulike-article-id = {5942469}, citeulike-linkout-0 = {http://www.worldcat.org/isbn/0791819000}, citeulike-linkout-1 = {http://books.google.com/books?vid=ISBN0791819000}, citeulike-linkout-2 = {http://www.amazon.com/gp/search?keywords=0791819000\&index=books\&linkCode=qs}, citeulike-linkout-3 = {http://www.librarything.com/isbn/0791819000}, citeulike-linkout-4 = {http://www.worldcat.org/oclc/45613360}, comment = {(private-note)found for containing Zeng et al}, editor = {Lee, Abraham P. and Simon, J. and Foster, F. K. and Keynton, R. S.}, interhash = {996ddc94cdaf72c9577d5d47d3ae1a41}, intrahash = {00bb26a267267b3c0a181ef703951e60}, isbn = {0791819000}, keywords = {mems 78a55-optics-electromagnetic-theory-technical-applications}, location = {November 5-10, 2000, Orlando, Florida}, posted-at = {2009-10-15 07:20:00}, priority = {2}, publisher = {American Society of Mechanical Engineers}, timestamp = {2019-07-02T02:17:41.000+0200}, title = {{Micro-electro-mechanical systems (MEMS), 2000 : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2000, Orlando, Florida}}, url = {http://www.worldcat.org/isbn/0791819000}, year = 2000 }