%0 Conference Paper %1 conf/biocas/DawesCJ23 %A Dawes, Jacob %A Chou, Tzu-Hsuan %A Johnston, Matthew L. %B BioCAS %D 2023 %I IEEE %K dblp %P 1-5 %T Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. %U http://dblp.uni-trier.de/db/conf/biocas/biocas2023.html#DawesCJ23 %@ 979-8-3503-0026-0

@inproceedings{conf/biocas/DawesCJ23, added-at = {2024-02-08T00:00:00.000+0100}, author = {Dawes, Jacob and Chou, Tzu-Hsuan and Johnston, Matthew L.}, biburl = {https://www.bibsonomy.org/bibtex/2597cf7bb167a35a751773aafb9889b33/dblp}, booktitle = {BioCAS}, crossref = {conf/biocas/2023}, ee = {https://doi.org/10.1109/BioCAS58349.2023.10388923}, interhash = {5c227934e4c99bb7769dd42e057eaa9e}, intrahash = {597cf7bb167a35a751773aafb9889b33}, isbn = {979-8-3503-0026-0}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2024-04-09T19:35:03.000+0200}, title = {Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects.}, url = {http://dblp.uni-trier.de/db/conf/biocas/biocas2023.html#DawesCJ23}, year = 2023 }