%0 Journal Article %1 journals/jssc/XuPRSES11 %A Xu, Hongtao %A Palaskas, Yorgos %A Ravi, Ashoke %A Sajadieh, Masoud %A El-Tanani, Mohammed A. %A Soumyanath, Krishnamurthy %D 2011 %J IEEE J. Solid State Circuits %K dblp %N 7 %P 1596-1605 %T A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application. %U http://dblp.uni-trier.de/db/journals/jssc/jssc46.html#XuPRSES11 %V 46

@article{journals/jssc/XuPRSES11, added-at = {2020-10-26T00:00:00.000+0100}, author = {Xu, Hongtao and Palaskas, Yorgos and Ravi, Ashoke and Sajadieh, Masoud and El-Tanani, Mohammed A. and Soumyanath, Krishnamurthy}, biburl = {https://www.bibsonomy.org/bibtex/2a6a07b3b15355a4182dedaa50c818b83/dblp}, ee = {https://doi.org/10.1109/JSSC.2011.2143930}, interhash = {3cc2f9ec579d4fe768fde0910e2fef93}, intrahash = {a6a07b3b15355a4182dedaa50c818b83}, journal = {IEEE J. Solid State Circuits}, keywords = {dblp}, number = 7, pages = {1596-1605}, timestamp = {2020-10-27T11:39:56.000+0100}, title = {A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application.}, url = {http://dblp.uni-trier.de/db/journals/jssc/jssc46.html#XuPRSES11}, volume = 46, year = 2011 }