Inproceedings,
Design of 224Gb/s DSP-Based Transceiver in CMOS Technology: Signal Integrity, Architecture, Circuits, and Packaging.
J. Kim, A. Cohen, M. Li, A. Balankutty, S. Kundu, A. Khairi, Y. Krupnik, Y. Segal, M. Cusmai, D. Lazar, A. Gordon, N. Familia, K. Yu, Y. Liu, M. Beach, P. Wali, H. Wu, M. Shimanouchi, J. Jiang, Z. Qian, K. Aygun, I. Levin, and F. O'Mahony.CICC, page 1-8. IEEE, (2024)
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- entry type
- inproceedings
- booktitle
- CICC
- year
- 2024
- pages
- 1-8
- publisher
- IEEE
- crossref
- conf/cicc/2024
- ee
- https://doi.org/10.1109/CICC60959.2024.10528970
- isbn
- 979-8-3503-9406-1
- url
- http://dblp.uni-trier.de/db/conf/cicc/cicc2024.html#KimCLBKKKSCLGFYLBWWSJQALO24
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%1 conf/cicc/KimCLBKKKSCLGFYLBWWSJQALO24
%A Kim, Jihwan
%A Cohen, Ariel
%A Li, Mike Peng
%A Balankutty, Ajay
%A Kundu, Sandipan
%A Khairi, Ahmad
%A Krupnik, Yoel
%A Segal, Yoav
%A Cusmai, Marco
%A Lazar, Dror
%A Gordon, Ari
%A Familia, Noam
%A Yu, Kai
%A Liu, Yutao
%A Beach, Matthew
%A Wali, Priya
%A Wu, Hsinho
%A Shimanouchi, Masashi
%A Jiang, Jenny Xiaohong
%A Qian, Zhiguo
%A Aygun, Kemal
%A Levin, Itamar
%A O'Mahony, Frank
%B CICC
%D 2024
%I IEEE
%K dblp
%P 1-8
%T Design of 224Gb/s DSP-Based Transceiver in CMOS Technology: Signal Integrity, Architecture, Circuits, and Packaging.
%U http://dblp.uni-trier.de/db/conf/cicc/cicc2024.html#KimCLBKKKSCLGFYLBWWSJQALO24
%@ 979-8-3503-9406-1
@inproceedings{conf/cicc/KimCLBKKKSCLGFYLBWWSJQALO24,
added-at = {2024-06-03T00:00:00.000+0200},
author = {Kim, Jihwan and Cohen, Ariel and Li, Mike Peng and Balankutty, Ajay and Kundu, Sandipan and Khairi, Ahmad and Krupnik, Yoel and Segal, Yoav and Cusmai, Marco and Lazar, Dror and Gordon, Ari and Familia, Noam and Yu, Kai and Liu, Yutao and Beach, Matthew and Wali, Priya and Wu, Hsinho and Shimanouchi, Masashi and Jiang, Jenny Xiaohong and Qian, Zhiguo and Aygun, Kemal and Levin, Itamar and O'Mahony, Frank},
biburl = {https://www.bibsonomy.org/bibtex/26f3017d8962fade4895dabe4e672277f/dblp},
booktitle = {CICC},
crossref = {conf/cicc/2024},
ee = {https://doi.org/10.1109/CICC60959.2024.10528970},
interhash = {9843581936df0135bee344a3ed901682},
intrahash = {6f3017d8962fade4895dabe4e672277f},
isbn = {979-8-3503-9406-1},
keywords = {dblp},
pages = {1-8},
publisher = {IEEE},
timestamp = {2024-06-10T07:15:20.000+0200},
title = {Design of 224Gb/s DSP-Based Transceiver in CMOS Technology: Signal Integrity, Architecture, Circuits, and Packaging.},
url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2024.html#KimCLBKKKSCLGFYLBWWSJQALO24},
year = 2024
}