Abstract
Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. Collection of 83 full-length, peer-reviewed technical papers from annual symposia. Major areas of discussion include: Microelectromechanical Systems:Design Methodology, Modeling and Characterization of MEMS; Novel Micromachining Processes and Packaging of MEMS; MEMS Applications; Microsensors and Microactuators; Micro-thermomechanical Devices and Microscale Heat Transfer; MEMS Device Design and Fabrication; Mechanics and Dynamics of MEMS. Microfluids: Behavior of Fluids in Microdevices, Observations and Measurements; Microfluidic Mixing and Separation Techniques; Component for Microfluidic Systems; Numerical Approaches to Microfluidic Device Development. MEMS Packaging and Packaging Review: Medical Applications of Microfluidic Systems & Sensors: Issues in the Manufacturing of MEMS and Related Micromechanical Systems
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