%0 Conference Paper %1 conf/elinfocom/RanjanBKK22 %A Ranjan, Navin %A Bhandari, Sovit %A Kim, Yeong-Chan %A Kim, Hoon %B ICEIC %D 2022 %I IEEE %K dblp %P 1-4 %T Polycrystalline Silicon Wafer Scratch Segmentation based on Deep Convolutional Autoencoder. %U http://dblp.uni-trier.de/db/conf/elinfocom/iceic2022.html#RanjanBKK22 %@ 978-1-6654-0934-6

@inproceedings{conf/elinfocom/RanjanBKK22, added-at = {2022-04-21T00:00:00.000+0200}, author = {Ranjan, Navin and Bhandari, Sovit and Kim, Yeong-Chan and Kim, Hoon}, biburl = {https://www.bibsonomy.org/bibtex/2afbfa1a9813bfed3110e4ef377ca75bc/dblp}, booktitle = {ICEIC}, crossref = {conf/elinfocom/2022}, ee = {https://doi.org/10.1109/ICEIC54506.2022.9748336}, interhash = {f60f959852de9626112aac0e6f4ddabb}, intrahash = {afbfa1a9813bfed3110e4ef377ca75bc}, isbn = {978-1-6654-0934-6}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-09T14:56:21.000+0200}, title = {Polycrystalline Silicon Wafer Scratch Segmentation based on Deep Convolutional Autoencoder.}, url = {http://dblp.uni-trier.de/db/conf/elinfocom/iceic2022.html#RanjanBKK22}, year = 2022 }