( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
An analytical model of the overshooting effect for multiple-input gates in nanometer technologies.

, , , , и . ISCAS, стр. 1712-1715. IEEE, (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Atsushi Imai

Atsushi Imai

Atsushi Yagi

Atsushi Fukui

Atsushi Kambayashi

 

Другие публикации лиц с тем же именем

Modeling of substrate contacts in TSV-based 3D ICs., , , , , , и . 3DIC, стр. 1-4. IEEE, (2014)Effect of substrate contacts on reducing crosstalk noise between TSVs., , , , , , и . APCCAS, стр. 763-766. IEEE, (2014)Effective capacitance for gate delay with RC loads., , и . ISCAS (3), стр. 2795-2798. IEEE, (2005)Capacitance and Yield Evaluations Using a 90-nm Process Technology Based on the Dense Power-Ground Interconnect Architecture., , , , , и . ISQED, стр. 153-158. IEEE Computer Society, (2005)Signal Propagation Delay Model in Vertically Stacked Chips., , , , и . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 98-A (12): 2614-2624 (2015)Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs., , и . ISQED, стр. 283-288. IEEE, (2017)An analytical model of the overshooting effect for multiple-input gates in nanometer technologies., , , , и . ISCAS, стр. 1712-1715. IEEE, (2013)An effective model for evaluating vertical propagation delay in TSV-based 3-D ICs., , , , , , и . ISQED, стр. 519-523. IEEE, (2015)A simple yet precise capacitance estimation method for on-chip power delivery network towards EMC analysis., , , , , и . IEICE Electron. Express, 17 (14): 20200198 (2020)Deep Neural Network Based Inductance Calculations of Wireless Power Transfer Systems., , , , и . GCCE, стр. 222-223. IEEE, (2022)