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A modularized 3D heterogeneous system integration platform., , , , , , , , и . APCCAS, стр. 396-399. IEEE, (2012)Implementation and Prototyping of a Complex Multi-project System-on-a-chip., , , , , , , и . ISCAS, стр. 2321-2324. IEEE, (2009)PrSoC: Programmable System-on-chip (SoC) for silicon prototyping., , , и . ISCAS, стр. 3382-3385. IEEE, (2008)An efficient memory controller for 3D heterogeneous integration platform., , , , , и . VLSI-DAT, стр. 1-4. IEEE, (2012)Live Demonstration: SenCu - A Power-Efficient Sensor System., , , , , , , и . IEEE SENSORS, стр. 1. IEEE, (2020)AI-EMS: An Environmental Monitoring System with AI Prediction., , , , , , , , и . SENSORS, стр. 1-4. IEEE, (2023)Live Demonstration: A Plug-and-Sense Smart Sensor System., , , , , и . IEEE SENSORS, стр. 1. IEEE, (2019)A framework for the design of error-aware power-efficient fixed-width Booth multipliers., , , , и . ISCAS (1), стр. 81-84. IEEE, (2005)Boundary scan test solution for MorPACK platform., , , , , , , , и . ISPACS, стр. 802-805. IEEE, (2012)A novel design flow for a 3D heterogeneous system prototyping platform., , , , , , , , , и . SoCC, стр. 78-82. IEEE, (2012)