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Mechanical strain and temperature aware design methodology for thin-film transistor based pseudo-CMOS logic array.

W. Sun, Y. Huang, Q. Zhao, F. Qiao, T. Ho, X. Guo, H. Yang, and Y. Liu. ASP-DAC, page 645-650. IEEE, (2018)

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Liu Liu

Jiaru Liu

Kang Liu

Other publications of authors with the same name

Flexible Circuits and Systems for Smart Biomedical Applications.Y. Liu. VLSI-DAT, page 1. IEEE, (2019)A Hierarchical Approach for Incremental Floorplan Based on Genetic Algorithms.Y. Liu, H. Yang, R. Luo, and H. Wang. ICNC (3), volume 3612 of Lecture Notes in Computer Science, page 219-224. Springer, (2005)Accurate temperature-dependent integrated circuit leakage power estimation is easy.Y. Liu, R. Dick, L. Shang, and H. Yang. DATE, page 1526-1531. EDA Consortium, San Jose, CA, USA, (2007)SPaC: a segment-based parallel compression for backup acceleration in nonvolatile processors.X. Sheng, Y. Wang, Y. Liu, and H. Yang. DATE, page 865-868. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Utilizing voltage-frequency islands in C-to-RTL synthesis for streaming applications.X. He, S. Li, Y. Liu, X. Hu, and H. Yang. DATE, page 992-995. EDA Consortium San Jose, CA, USA / ACM DL, (2013)STICKER-IM: A 65 nm Computing-in-Memory NN Processor Using Block-Wise Sparsity Optimization and Inter/Intra-Macro Data Reuse.J. Yue, Y. Liu, Z. Yuan, X. Feng, Y. He, W. Sun, Z. Zhang, X. Si, R. Liu, Z. Wang and 5 other author(s). IEEE J. Solid State Circuits, 57 (8): 2560-2573 (2022)Self-powered wearable sensor node: Challenges and opportunities.Y. Liu, H. Li, X. Li, C. Xue, Y. Xie, and H. Yang. CASES, page 189. IEEE, (2015)Circuit design for beyond von Neumann applications using emerging memory: From nonvolatile logics to neuromorphic computing.W. Chen, W. Khwa, J. Li, W. Lin, H. Lin, Y. Liu, Y. Wang, H. Wu, H. Yang, and M. Chang. ISQED, page 23-28. IEEE, (2017)Evaluation of Tunable Data Compression in Energy-Aware Wireless Sensor Networks.B. Ying, Y. Liu, H. Yang, and H. Wang. Sensors, 10 (4): 3195-3217 (2010)A 28nm 1.07TFLOPS/mm2 Dynamic-Precision Training Processor with Online Dynamic Execution and Multi- Level-Aligned Block-FP Processing.Y. Yang, R. Liu, C. Wei, W. Wang, W. Sun, J. Yue, H. Yang, and Y. Liu. CICC, page 1-2. IEEE, (2023)

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Disambiguation of "Liu, Yongpan"

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Mechanical strain and temperature aware design methodology for thin-film transistor based pseudo-CMOS logic array.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Jiaru Liu

Kang Liu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liu, Yongpan"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Mechanical strain and temperature aware design methodology for thin-film transistor based pseudo-CMOS logic array.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Jiaru Liu

Kang Liu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
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APA
Chicago
DIN 1505
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Mechanical strain and temperature aware design methodology for thin-film transistor based pseudo-CMOS logic array.