From post

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

 

Другие публикации лиц с тем же именем

A performance-aware I/O interface for 3D stacked memory systems., , , и . UEMCON, стр. 369-371. IEEE, (2017)Three-Dimensional Pipeline ADC Utilizing TSV/ Design Optimization and Memristor Ratioed Logic., , , и . IEEE Trans. Very Large Scale Integr. Syst., 26 (12): 2619-2627 (2018)High-performance RF-interconnect for 3D stacked memory., , , , и . ISOCC, стр. 109-110. IEEE, (2017)A 3D flash ADC structure for high-speed communication applications., , , и . CCWC, стр. 956-958. IEEE, (2018)Evolving More Testable Digital Combinational Circuits., , и . CDES, стр. 40-45. CSREA Press, (2010)3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise Shielding, and High Interconnect Density., и . ISQED, стр. 269-274. IEEE, (2021)A low-power and performance-efficient SAR ADC design., , , , и . ISOCC, стр. 3-4. IEEE, (2017)A Macromodeling Approach for Analog Behavior of Digital Integrated Circuits., и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (12): 5025-5031 (2020)Low-power and high-performance 2.4 GHz RF transmitter for biomedical application., , , и . UEMCON, стр. 389-391. IEEE, (2017)Design of a Pre-Distortion Power Amplifier for Ku-Band/5G Applications., , , и . EIT, стр. 808-811. IEEE, (2018)