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Real Chip Performance Evaluation on Through Chip Interface IP for Renesas SOTB 65nm Process., , , , and . CANDAR Workshops, page 269-274. IEEE, (2019)6W/25mm2 inductive power transfer for non-contact wafer-level testing., , , , , , and . ISSCC, page 230-232. IEEE, (2011)An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories., , , , , , , and . IEEE J. Solid State Circuits, 51 (4): 1041-1050 (2016)Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory., , , , , , , and . VLSIC, page 128-. IEEE, (2015)6 W/25 mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing., , , , , , and . IEICE Trans. Electron., 95-C (4): 668-676 (2012)A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler., , , , , , , and . ISSCC, page 200-201. IEEE, (2013)A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme., , , , , , , and . IEEE J. Solid State Circuits, 46 (4): 965-973 (2011)