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Translation-Invariant Multiscale Energy-Based PCA for Monitoring Batch Processes in Semiconductor Manufacturing.

, , , and . IEEE Trans Autom. Sci. Eng., 14 (2): 894-904 (2017)

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Translation-Invariant Multiscale Energy-Based PCA for Monitoring Batch Processes in Semiconductor Manufacturing., , , and . IEEE Trans Autom. Sci. Eng., 14 (2): 894-904 (2017)Application of Principal Components Analysis to improve fault detection and diagnosis on semiconductor manufacturing equipment., , and . ECC, page 1445-1450. IEEE, (2013)From Alarm System Events Towards Quality Inspection of The Final Product: Application to a Semiconductor Industry., , , , and . ECC, page 1768-1773. IEEE, (2021)Run-to-Run sensor variation monitoring for process fault diagnosis in semiconductor manufacturing., , and . WSC, page 2523-2534. IEEE, (2016)A smart sampling scheduling and skipping simulator and its evaluation on real data sets., , , , , and . WSC, page 1908-1917. IEEE, (2011)Regularized regression models to predict the product quality in multistep manufacturing., , , and . ICSC, page 31-36. IEEE, (2016)Evaluation of Alarm System Performance and Management in Semiconductor Manufacturing., , , , and . CoDIT, page 1155-1160. IEEE, (2019)Constructing DEVS models based on experts' knowledge: application to STMicroelectronics' large scale manufacturing processes., , and . SpringSim (TMS-DEVS), page 193-198. SCS/ACM, (2011)Data-Based Approach for Final Product Quality Inspection: Application to a Semiconductor Industry., , , , and . CDC, page 1356-1362. IEEE, (2021)Skipping algorithms for defect inspection using a dynamic control strategy in semiconductor manufacturing., , , and . WSC, page 3684-3695. IEEE, (2013)