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Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

, , , , и . Journal of Electronic Materials, 42 (3): 372-381 (2013)
DOI: 10.1007/s11664-012-2366-1

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Simon M M Laimer

M. Biswas M. Dam

Marcel M M Kuypers

Bernhard M M Lang

Doris M M Eggert

 

Другие публикации лиц с тем же именем

Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications, , , , , и . Components, Packaging and Manufacturing Technology, IEEE Transactions on, 4 (12): 1906-1913 (декабря 2014)Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module, , , , и . Journal of Electronic Materials, 42 (3): 372-381 (2013)