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Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2024)Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2024)High-ohmic resistors using nanometer-thin pure-boron chemical-vapour-deposited layers., , , and . ESSDERC, page 210-213. IEEE, (2013)Silicon Photonics for 56G NRZ Optical Interconnects., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2018)Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon., , , , , and . 3DIC, page 1-4. IEEE, (2010)Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2024)Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics., , , , , , , , and . IEICE Trans. Electron., 97-C (4): 227-237 (2014)