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A new calibration method for MEMS accelerometers with genetic algorithm., , , и . RCAR, стр. 240-245. IEEE, (2017)Development of TSV simulator: FASTsv., , , , , и . NEMS, стр. 217-220. IEEE, (2011)In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging., , , , , и . NEMS, стр. 233-236. IEEE, (2013)A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge., , , , , и . NEMS, стр. 399-403. IEEE, (2010)Face Liveness Detection Competition (LivDet-Face) - 2021., , , , , , , , , и 22 other автор(ы). IJCB, стр. 1-10. IEEE, (2021)Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging., , , , и . NEMS, стр. 384-387. IEEE, (2016)New DfT architectures for 3D-SICs with a wireless test port., , , , и . ASICON, стр. 1-4. IEEE, (2013)Post-bond test for TSVs using voltage division., , , и . ASICON, стр. 1-4. IEEE, (2015)Design and Development of a Robotic Arm for Evaluation of Medical MEMS Sensors., , , , и . RCAR, стр. 305-310. IEEE, (2019)A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate., , , и . NEMS, стр. 796-799. IEEE, (2011)