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Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization., , , , , , and . ICCAD, page 1-7. IEEE, (2023)Heterogeneous and Elastic Computation Framework for Mobile Cloud Computing., , , and . Int. J. Softw. Eng. Knowl. Eng., 24 (7): 1013-1038 (2014)Applications of Large Language Models in Data Processing: Innovative Approaches to Segmenting and Renewing Information., , , , , , , and . CoRR, (2023)Layout-level Vulnerability Ranking from Electromagnetic Fault Injection., , , , , , , , and . HOST, page 17-20. IEEE, (2022)Low-IR-Drop Test Pattern Regeneration Using A Fast Predictor., , , , , , , and . ISQED, page 27-32. IEEE, (2022)ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs., , , , , , , , and . VLSI-DAT, page 1-8. IEEE, (2022)Multiphysics Simulation of EM Side-Channels from Silicon Backside with ML-based Auto-POI Identification., , , , , , , , , and 1 other author(s). HOST, page 270-280. IEEE, (2021)Bad page relaxation to prolong the lifetime of flash devices., , , , , and . GCCE, page 715-716. IEEE, (2014)Clocktree RLC Extraction with Efficient Inductance Modeling., , , , and . DATE, page 522-526. IEEE Computer Society / ACM, (2000)Applying Machine Learning to Design for Reliability Coverage., , , , , , , , , and 4 other author(s). IRPS, page 1-7. IEEE, (2019)