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An Ultrafast Active Quenching Circuit for SPAD in CMOS 28nm FDSOI Technology.

, , , , and . IEEE SENSORS, page 1-4. IEEE, (2020)

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Impact of low-frequency substrate disturbances on a 4.5GHz VCO., , , , , and . Microelectron. J., 37 (10): 1119-1127 (2006)FPGA and Mixed FPGA-DSP Implementations of Electrical Drive Algorithms., , , , , and . FPL, volume 2438 of Lecture Notes in Computer Science, page 1144-1147. Springer, (2002)An Active Quenching Circuit for a Native 3D SPAD Pixel in a 28 nm CMOS FDSOI Technology., , , , , , and . NEWCAS, page 1-4. IEEE, (2021)Characterization and modeling of DCR and DCR drift variability in SPADs., , , , and . IRPS, page 1-5. IEEE, (2023)Wideband 2.5 GHz VCO with active inductance in a 0.25 µm CMOS technology., and . ICECS, page 735-738. IEEE, (2009)Hot-Carrier Degradation modeling of DCR drift in SPADs., , and . ESSDERC, page 61-64. IEEE, (2023)Challenges and prospects of RF oscillators using silicon resonant tunneling diodes., , , , , , and . ESSCIRC, page 220-223. IEEE, (2009)Towards nano-computing blocks using room temperature double-gate single electron transistors., , and . NEWCAS, page 325-328. IEEE, (2014)Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking., , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)Electrical characterization and TCAD simulations of multi-gate bulk nMOSFET., , , , and . Microelectron. J., 46 (7): 588-592 (2015)