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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)Benefits of three-dimensional circuit stacking for image sensors., , , and . NEWCAS, page 1-4. IEEE, (2013)A photovoltaic mode pixel Embedding energy harvesting capability For future self-powered image sensors., , and . NEWCAS, page 261-264. IEEE, (2018)Pixel-level ADC by small charge quantum counting., , , , and . ICECS, page 423-426. IEEE, (2006)Systemc modelization for fast validation of imager architectures., , and . DASIP, page 341-345. IEEE, (2011)An 88dB SNR, 30µm pixel pitch Infra-Red image sensor with a 2-step 16 bit A/D conversion., , , , , , and . VLSIC, page 128-129. IEEE, (2012)Smart imagers modeling and optimization framework for embedded AI applications., , , and . PRIME, page 245-248. IEEE, (2019)High Dynamic Range image sensor with self adapting integration time in 3D technology., , , and . ICECS, page 340-343. IEEE, (2012)Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels., , , , and . MOCAST, page 1-4. IEEE, (2021)A novel 3D architecture for high-dynamic range image sensor and on-chip data compression., , , and . Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications, volume 7875 of SPIE Proceedings, page 78750T. SPIE, (2011)