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Ultra-fast silicon-based optoelectronic devices on a 300 mm CMOS platform for on-chip optical interconnects., , , , , , , , , and 2 other author(s). ICTON, page 1. IEEE, (2015)III-V/Si hybrid integration for scalable optical switching and computing., , , , , , , , , and 3 other author(s). OECC/PSC, page 1-3. IEEE, (2022)High-efficiency, Low-loss Optical Phase Modulator based on III-V/Si Hybrid MOS Capacitor., , , , , , and . OFC, page 1-3. IEEE, (2018)New parameter extraction method based on split C-V for FDSOI MOSFETs., , , , , , and . ESSDERC, page 217-220. IEEE, (2012)Impact of quantum modulation of the inversion charge in the MOSFET subthreshold regime., , , and . ESSDERC, page 286-289. IEEE, (2014)Reduced model for the comprehension of the operation of a thermo-mechanical energy harvester., , , , , and . NEWCAS, page 1-4. IEEE, (2015)25 Gbit/s O-Band push-pull Mach-Zehnder silicon modulator for datacom applications., , , , , , , , and . ICTON, page 1-4. IEEE, (2017)Predictive Delay Evaluation on Emerging CMOS Technologies: A Simulation Framework., , , , , , and . ISQED, page 492-497. IEEE Computer Society, (2008)Non Resonant Response to Terahertz Radiation by Submicron CMOS Transistors., , , , , , , , , and . IEICE Trans. Electron., 89-C (7): 993-998 (2006)32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit., , , , , , , , , and 4 other author(s). ISCAS, page 1703-1706. IEEE, (2010)