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Efficient region-aware P/G TSV planning for 3D ICs., , , , , и . ISQED, стр. 171-178. IEEE, (2014)Improved heuristic equivalent search algorithm based on Maximal Information Coefficient for Bayesian Network Structure Learning., , и . Neurocomputing, (2013)Robust Kernelized Multi-View Self-Representations for Clustering by Tensor Multi-Rank Minimization., , , и . CoRR, (2017)Die Stacking Is Happening, , и . IEEE Micro, 38 (1): 22--28 (2018)A low-power phase change memory based hybrid cache architecture., , , , , , и . ACM Great Lakes Symposium on VLSI, стр. 395-398. ACM, (2008)NoC-Sprinting: Interconnect for Fine-Grained Sprinting in the Dark Silicon Era., , и . DAC, стр. 160:1-160:6. ACM, (2014)A customized design of DRAM controller for on-chip 3D DRAM stacking., , , , , , , и . CICC, стр. 1-4. IEEE, (2010)3DLAT: TSV-based 3D ICs crosstalk minimization utilizing Less Adjacent Transition code., , , и . ASP-DAC, стр. 762-767. IEEE, (2014)Optimal topology exploration for application-specific 3D architectures., , , и . ASP-DAC, стр. 390-395. IEEE, (2006)Low-leakage robust SRAM cell design for sub-100nm technologies., , , , и . ASP-DAC, стр. 539-544. ACM Press, (2005)