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Disambiguation of "Chung, Shin-Young"

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Impact of Barrier Metal Thickness on SRAM Reliability.

, , , , , , , , , , , and . IRPS, page 1-6. IEEE, (2023)

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Young Gyu Shin

Young Shin Kim

Shin-Young Na

So-Young Shin

Young Shin Ko

 

Other publications of authors with the same name

Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method., , , and . ISOCC, page 44-45. IEEE, (2019)Polarity Dependency of MOL-TDDB in FinFET., , , , , , , , , and 2 other author(s). IRPS, page 1-3. IEEE, (2023)An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology., , , , , , , , , and . IRPS, page 1-5. IEEE, (2024)Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices., , , , , , , , and . IRPS, page 53-1. IEEE, (2022)Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM., , , , , and . IRPS, page 1-8. IEEE, (2023)Impacts of Post-Cu CMP Queue Time on Reliability., , , , , , , , , and 4 other author(s). IRPS, page 1-5. IEEE, (2024)A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation., , , , , , , , , and 6 other author(s). IRPS, page 5. IEEE, (2024)Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs., , , , , , , and . IRPS, page 1-8. IEEE, (2023)Impact of Barrier Metal Thickness on SRAM Reliability., , , , , , , , , and 2 other author(s). IRPS, page 1-6. IEEE, (2023)Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology., , , , , , , , and . IRPS, page 7. IEEE, (2022)