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The resilience wall: Cross-layer solution strategies., , , , , , , , , and 3 other author(s). VLSI-DAT, page 1-11. IEEE, (2014)Hot Chips 28., and . IEEE Micro, 37 (2): 5-6 (2017)Transforming nanodevices into nanosystems: The N3XT 1, 000X.. LATS, page 6. IEEE, (2016)Hyperdimensional Computing Nanosystem., , , , , , and . CoRR, (2018)Carbon nanotube computer: transforming scientific discoveries into working systems.. ISPD, page 117-118. ACM, (2014)Cross-layer resilience challenges: Metrics and optimization., , and . DATE, page 1029-1034. IEEE Computer Society, (2010)Bug localization techniques for effective post-silicon validation., , , and . ASP-DAC, page 291. IEEE, (2012)System-Level Effects of Soft Errors in Uncore Components., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 36 (9): 1497-1510 (2017)Effective Pre-Silicon Verification of Processor Cores by Breaking the Bounds of Symbolic Quick Error Detection., , , , , , , , and . CoRR, (2021)Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits., , , , , , , and . DAC, page 1-6. IEEE, (2023)