( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Real-time human body parts localization from dynamic vision sensor.

, , , , , , , и . ICIP, стр. 4783-4787. IEEE, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Xiaotao Wu

Wang Wang

Linfang Wang

Investigation of the functions of 53BP1 in DNA demethylation. Uni Marburg, (2009)

Hao Wang

Shifeng Wang

 

Другие публикации лиц с тем же именем

CoSign: Exploring Co-occurrence Signals in Skeleton-based Continuous Sign Language Recognition., , , , , и . ICCV, стр. 20619-20629. IEEE, (2023)Physics-Guided ISO-Dependent Sensor Noise Modeling for Extreme Low-Light Photography., , , , , и . CVPR, стр. 5744-5753. IEEE, (2023)Spatially Adaptive Self-Supervised Learning for Real-World Image Denoising., , , , , , и . CVPR, стр. 9914-9924. IEEE, (2023)Deep-FlexISP: A Three-Stage Framework for Night Photography Rendering., , , , , , и . CVPR Workshops, стр. 1210-1219. IEEE, (2022)Deep Radial Embedding for Visual Sequence Learning., , , , , , и . ECCV (6), том 13666 из Lecture Notes in Computer Science, стр. 240-256. Springer, (2022)Realistic Bokeh Effect Rendering on Mobile GPUs, Mobile AI & AIM 2022 Challenge: Report., , , , , , , , , и 14 other автор(ы). ECCV Workshops (3), том 13803 из Lecture Notes in Computer Science, стр. 153-173. Springer, (2022)A Velocity-Based Impedance Control System for a Low Impact Docking Mechanism (LIDM)., , , и . Sensors, 14 (12): 22998-23016 (2014)Kronecker Factorization-Based Multinomial Logistic Regression for Hyperspectral Image Classification.. IEEE Geosci. Remote. Sens. Lett., (2022)Fast ASA Modeling and Texturing Using Subgraph Isomorphism Detection Algorithm of Relational Model., , , и . MMM (2), том 7733 из Lecture Notes in Computer Science, стр. 535-537. Springer, (2013)Self-supervised Learning to Bring Dual Reversed Rolling Shutter Images Alive., , , , , и . ICCV, стр. 13040-13048. IEEE, (2023)