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A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver., , , , и . IEEE J. Solid State Circuits, 58 (7): 2075-2086 (2023)A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link., , , , , , , , и . IEEE J. Solid State Circuits, 42 (1): 111-122 (2007)A 40-Gb/s CMOS clocked comparator with bandwidth modulation technique., , , , , , , , и . IEEE J. Solid State Circuits, 40 (8): 1680-1687 (2005)A 10-Bit 80-MS/s Decision-Select Successive Approximation TDC in 65-nm CMOS., , и . IEEE J. Solid State Circuits, 47 (5): 1232-1241 (2012)A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme., , , , , , , и . IEEE J. Solid State Circuits, 46 (4): 965-973 (2011)A 40nm 50S/s-8MS/s ultra low voltage SAR ADC with timing optimized asynchronous clock generator., , , и . ESSCIRC, стр. 471-474. IEEE, (2011)Wideband Inductive-coupling Interface for High-performance Portable System., , и . CICC, стр. 13-20. IEEE, (2007)Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs., , , , и . IEICE Trans. Inf. Syst., 96-D (12): 2753-2764 (2013)A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel., , , , , и . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 98-A (12): 2584-2591 (2015)1W 3.3V-to-16.3V boosting wireless power transfer circuits with vector summing power controller., , , и . A-SSCC, стр. 177-180. IEEE, (2011)