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A 0.57-mW/Gbps, 2ch × 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-µm LD-Array-on-Si., , , , , , , , , and . OFC, page 1-3. IEEE, (2020)Automated Sperm Assessment Framework and Neural Network Specialized for Sperm Video Recognition., , , , and . CoRR, (2023)56-Gbit/s Operations of Mach-Zehnder Modulators using 300-μm-Long Membrane InGaAsP Phase Shifters and SiN waveguides on Si., , , , , , , and . OFC, page 1-3. IEEE, (2019)Heterogeneously integrated InP/Si metal-oxide-semiconductor capacitor Mach-Zehnder modulator., , , , , , , , and . OFC, page 1-3. IEEE, (2017)Ultra-High Bandwidth InP IQ Modulator co-assembled with Driver IC for Beyond 100-GBd CDM., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2018)Multicore-Fiber LC Receptacle with Compact Fan-in/Fan-out for Short-Reach Transceivers., , , , , , , , , and . OFC, page 1-3. IEEE, (2018)50-GHz-bandwidth Electro-absorption Modulator with Membrane InGaAsP Lateral p-i-n Diode on Si Platform., , , , , , , and . ECOC, page 1-4. IEEE, (2020)Net 321.24-Gb/s IMDD Transmission Based on a >100-GHz Bandwidth Directly-Modulated Laser., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2020)4×56-GBaud PAM-4 SDM Transmission over 5.9-km 125-µm-Cladding MCF using III-V-on-Si DMLs., , , , , , , , and . OFC, page 1-3. IEEE, (2020)30-Gbps/ch x 4 ch Simultaneous Error-Free Transmission with A Low-Power Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si., , , , , , , , , and . OFC, page 1-3. IEEE, (2023)